HONOR Magic8 series debuted in China last month , with the Pro model launching globally on November 27th . Besides these, we’ve been hearing rumors about an Ultra variant and the Magic8 Mini. The latter, as the name suggests, should arrive as a compact flagship. A new leak on Weibo offers us more than just the name . We now have some key HONOR Magic8 Mini specs, like the chipset and battery.
HONOR Magic8 Mini specs have leaked on Weibo
Prolific leaker Digital Chat Station on Weibo goes on to claim that the HONOR Magic8 Mini will be the “industry’s first ultra-thin and lightweight small-screen flagship.” He says the thickness of the phone will be 5-6.xmm. For comparison, the iPhone Air measures 5.6mm, while the Galaxy S25 Edge is 5.8mm.
Despite having a slim profile, HONOR could fit it with a 5,500mAh battery . However, this is less than the 6,00mAh capacity that was reported initially. But it is still bigger than the 3,900mAh cell on the Galaxy S25 Edge, though.
MediaTek Dimensity 9500 and 6.31-inch display
Other HONOR Magic8 Mini specs could include a 6.31-inch 1.5K LTPO display with flat edges. However, there’s no mention of the panel type. The phone may feature the MediaTek Dimensity 9500, which is no mean chip when it comes to performance. For comparison, though, the Magic8 and Magic8 Pro get the Qualcomm Snapdragon 8 Elite Gen 5.
Speaking of cameras, Digital Chat Station says the Magic8 Mini will get a 50MP 1/1.5 sensor instead of a 200MP lens. There will also be an upgraded telephoto lens for your zoom shots. Previous leaks say the phone could get wireless charging and a 3D ultrasonic fingerprint sensor.
The leak doesn’t say anything about its launch timeline, but it may debut in early 2026. When it does launch, though, it’ll take on other compact phones like the Vivo X300 and Xiaomi 17.
