Samsung and Intel are known for having a troublesome journey in the semiconductor field. Both companies are often overshadowed by NVIDIA, AMD, and TSMC. However, things might change soon as Samsung is reportedly planning to invest in Intel’s packaging technology. The two companies could team up to better compete with their rivals.

Samsung considers using Intel’s packaging and glass substrate technology

As per the information shared by BusinessPost, Samsung is considering making use of Intel’s packaging and glass substrate technology. The company mainly wants to focus on the glass substrate tech, as this is an area where Intel has dominated consistently. The packaging process may be used in the production lines that are being set up in the US.

The Chairman of Samsung Electronics, Jay Y. Lee, will be visiting the US soon. He will be part of South Korea’s economic delegation for the business summit. This strategic partnership between the two companies may be announced at the summit. This could not only give a boost to the respective company’s chip manufacturing but could heat up the competition as well.

The tie-up between the brand might be a problem for the competitors

While the two companies are often overshadowed by others, it doesn’t mean they have inferior tech or weaker production lines. Samsung is known for having one of the best front-end chip manufacturing, while Intel is popular for its back-end manufacturing. Front-end involves placing the wafers and circuit in place, whereas the back-end is more about packaging and testing.

If both companies bring the best of their worlds, it can surely result in the development of a powerful semiconductor . Something that the competitors don’t want. Samsung currently relies on other back-end companies for the packaging process, and shifting that to Intel could really up its game.

Glass substrates, on the other hand, are a newer surface tech that happens to be smoother, thinner, and comes with high thermal density compared to the plastic substrate. Both of these combined could give some really good results for Samsung and Intel .