With Samsung’s upcoming Exynos 2600, which will be its flagship chip for 2026, the company is going to introduce a new heat dissipation technology. This could help bring Qualcomm back to Samsung’s foundry for manufacturing top Snapdragon chips.
Currently, Qualcomm uses TSMC to manufacture a lot of its chips, but specifically the Snapdragon 8 series. And lately, the Snapdragon 8 Elite and now the Snapdragon 8 Elite Gen 5 have been running pretty hot. And this new heat dissipation technology could bring Qualcomm back to Samsung to fix this heat issue.
This is all according to a report out of Korea, where Samsung has formally announced its technology to address heat-related throttling issues . This technology is called Heat Pass Block or HPB, and it comprises a passive copper heatsink integrated within the chipset to offer better heat dissipation.
Exynos 2600 could be the first 2nm mobile chipset
Samsung hasn’t yet announced the Exynos 2600, but it has mentioned its name a few times. So we know that it will be called the ‘Exynos 2600’. We expect to see an announcement pretty soon. But many are expecting that this could be the first 2nm mobile chipset, and it’ll also feature a deca-core CPU. As if that wasn’t enough, the GPU would be featuring NVIDIA’s tech stack. That would really bring Exynos back to prominence, if all of this is true.
Samsung has been investing a lot of money in 2nm, since they missed the boat on 3nm. Samsung Foundry wants to ensure it can bring back some of its customers with 2nm. Currently, almost everyone is using TSMC, which literally has no space left to manufacture other chips. Even Google ditched Samsung for TSMC with the Tensor G5 this year.
We do know that, at least for the US, the Samsung Galaxy S26 Ultra will still use the Snapdragon 8 Elite Gen 5 , however.
